| PART |
Description |
Maker |
| GP-VOSOFT |
Thermal conductivity: 0.8 W/m-K
|
List of Unclassifed Man...
|
| CPW CPWN |
High Thermal Conductivity And Humidity Resistance
|
Vishay Intertechnology
|
| MSK3015-15 |
Isolated Package for Direct Heat Sinking, Excellent Thermal Conductivity
|
M.S. Kennedy Corporatio...
|
| CP |
Commercial Power, Axial Lead, Fireproof Inorganic Construction, Fusible Styles Available, Meets or Exceeds Requirements of EIA Standard RS-344, High Thermal Conductivity and Humidity Resistance
|
Vishay
|
| MX7-SGC3-7000 |
HIGH CONDUCTIVITY COPPER ALLOY
|
http://
Japan Aviation Electronics Industry, Ltd.
|
| KD3004-DC70A KD3003-DF10A |
Thick film thermal printhead (with thermal historical control)
Compact high speed thick film thermal printhead (12 dots / mm)
|
ROHM[Rohm]
|
| SE3002-DC70A |
High speed thermal printhead (with thermal historical control)
|
Rohm
|
| KD2002-DC70A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| KF3002-GM50A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| KD2002-DC72A |
Thick film thermal printhead(with thermal historical control)
|
Rohm
|
| KD3002-DC72A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
